Choong-Jae Lee

41 papers and 324 indexed citations i.

Choong-Jae Lee has authored 41 papers that have received a total of 324 indexed citations. This includes 38 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 7 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (26 papers) and Nanomaterials and Printing Technologies (6 papers). Choong-Jae Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (26 papers) and Nanomaterials and Printing Technologies (6 papers) and collaborates with scholars based in South Korea. Choong-Jae Lee's co-authors include Seung‐Boo Jung, Kwang‐Ho Jung, Yong‐Il Kim, Jinho Joo and Ja‐Myeong Koo and has published in prestigious journals such as Applied Surface Science, Journal of Alloys and Compounds and Composites Part B Engineering