Choong-Un Kim
About
Choong-Un Kim has authored 25 papers that have received a total of 381 indexed citations.
This includes 24 papers in Electrical and Electronic Engineering, 8 papers in Materials Chemistry and 8 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (8 papers) and Semiconductor materials and devices (7 papers). Choong-Un Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (8 papers) and Semiconductor materials and devices (7 papers) and collaborates with scholars based in United States, Finland and Indonesia. Choong-Un Kim's co-authors include Tae-Kyu Lee, Thomas R. Bieler, Man‐Jong Lee, Ramkumar Subramanian and E. Todd Ryan and has published in prestigious journals such as Nano Letters, Applied Physics Letters and Journal of Applied Physics
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