C.-P Hung

17 papers and 74 indexed citations i.

C.-P Hung has authored 17 papers that have received a total of 74 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 1 paper in Materials Chemistry and 1 paper in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (12 papers) and Electromagnetic Compatibility and Noise Suppression (7 papers). C.-P Hung is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (12 papers) and Electromagnetic Compatibility and Noise Suppression (7 papers) and collaborates with scholars based in Taiwan. C.-P Hung's co-authors include Meng-Kai Shih, Wei‐Hong Lai, David Tarng, Shujing Wu and Karen Chen and has published in prestigious journals such as IEEE Transactions on Electron Devices, Materials and Electronics Letters