Daniel F. Baldwin

29 papers and 1.8k indexed citations i.

Daniel F. Baldwin has authored 29 papers that have received a total of 1.8k indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 10 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), Polymer Foaming and Composites (9 papers) and 3D IC and TSV technologies (7 papers). Daniel F. Baldwin is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Polymer Foaming and Composites (9 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in United States, Canada and South Korea. Daniel F. Baldwin's co-authors include Nam P. Suh, Chul B. Park, Sang-Il Lee, Myung Jin Yim and John L. Evans and has published in prestigious journals such as Journal of Applied Physics, Biomaterials and Nanotechnology