David Bušek

52 papers and 320 indexed citations i.

David Bušek has authored 52 papers that have received a total of 320 indexed citations. This includes 44 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 11 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (8 papers). David Bušek is often cited by papers focused on Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (8 papers) and collaborates with scholars based in Czechia, Hungary and Poland. David Bušek's co-authors include Balázs Illés, Karel Dušek, Attila Géczy, Olivér Krammer and Agata Skwarek and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Sensors and Journal of Alloys and Compounds