D.C. Whalley
About
D.C. Whalley has authored 101 papers that have received a total of 1.0k indexed citations.
This includes 86 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 25 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (70 papers), 3D IC and TSV technologies (42 papers) and Material Properties and Processing (10 papers). D.C. Whalley is often cited by papers focused on Electronic Packaging and Soldering Technologies (70 papers), 3D IC and TSV technologies (42 papers) and Material Properties and Processing (10 papers) and collaborates with scholars based in United Kingdom, Sweden and Hong Kong. D.C. Whalley's co-authors include S.H. Mannan, David A. Hutt, Paul Conway, David Williams and F. Sarvar and has published in prestigious journals such as Applied Physics Letters, Acta Materialia and ACS Applied Materials & Interfaces
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