E. Meusel

13 papers and 202 indexed citations i.

E. Meusel has authored 13 papers that have received a total of 202 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (9 papers) and Advanced Welding Techniques Analysis (2 papers). E. Meusel is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (9 papers) and Advanced Welding Techniques Analysis (2 papers) and collaborates with scholars based in Germany, United States and Australia. E. Meusel's co-authors include Sven Rzepka, S. Wiese, M. A. Korhonen, Che‐Yu Li and Florian Kriebel and has published in prestigious journals such as Sensors and Actuators A Physical, Polymers for Advanced Technologies and Microsystem Technologies