E. Zakel

17 papers and 93 indexed citations i.

E. Zakel has authored 17 papers that have received a total of 93 indexed citations. This includes 14 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Electrical Contact Performance and Analysis (3 papers). E. Zakel is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Electrical Contact Performance and Analysis (3 papers) and collaborates with scholars based in Germany. E. Zakel's co-authors include H. Reichl, S. Weiß, R. Aschenbrenner, A. Ostmann and B. Peplinski and has published in prestigious journals such as Materials science forum, ECS Transactions and IEEE Transactions on Components Packaging and Manufacturing Technology Part A