Fengwen Mu

60 papers and 1.1k indexed citations i.

Fengwen Mu has authored 60 papers that have received a total of 1.1k indexed citations. This includes 46 papers in Electrical and Electronic Engineering, 21 papers in Materials Chemistry and 17 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (27 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (14 papers). Fengwen Mu is often cited by papers focused on 3D IC and TSV technologies (27 papers), Semiconductor materials and devices (17 papers) and Electronic Packaging and Soldering Technologies (14 papers) and collaborates with scholars based in Japan, China and United States. Fengwen Mu's co-authors include Tadatomo Suga, Xin Ou, Tiangui You, Wenhui Xu and Masahisa Fujino and has published in prestigious journals such as Applied Physics Letters, Acta Materialia and ACS Applied Materials & Interfaces