Gokul Kumar

4 papers and 131 indexed citations i.

Gokul Kumar has authored 4 papers that have received a total of 131 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 1 paper in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (4 papers), Nanofabrication and Lithography Techniques (3 papers) and Electronic Packaging and Soldering Technologies (2 papers). Gokul Kumar is often cited by papers focused on 3D IC and TSV technologies (4 papers), Nanofabrication and Lithography Techniques (3 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in United States, South Korea and Japan. Gokul Kumar's co-authors include Venky Sundaram, Rao Tummala, Vijay Sukumaran, Yuya Suzuki and Qiao Chen and has published in prestigious journals such as IEEE Transactions on Components Packaging and Manufacturing Technology