Han-wen Lin

8 papers and 477 indexed citations i.

Han-wen Lin has authored 8 papers that have received a total of 477 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Copper Interconnects and Reliability (4 papers) and Aluminum Alloy Microstructure Properties (2 papers). Han-wen Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Copper Interconnects and Reliability (4 papers) and Aluminum Alloy Microstructure Properties (2 papers) and collaborates with scholars based in Taiwan and United States. Han-wen Lin's co-authors include Chih Chen, Chien-Min Liu, Chia-Ling Lu, Yi-Sa Huang and Jui‐Chao Kuo and has published in prestigious journals such as Science, Acta Materialia and Scientific Reports