Hun Shen Ng

9 papers and 190 indexed citations i.

Hun Shen Ng has authored 9 papers that have received a total of 190 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Metal Forming Simulation Techniques (2 papers). Hun Shen Ng is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Metal Forming Simulation Techniques (2 papers) and collaborates with scholars based in Singapore, Switzerland and Czechia. Hun Shen Ng's co-authors include Tong Yan Tee, Z.W. Zhong, D. Yap, Chwee Teck Lim and E. Pek and has published in prestigious journals such as Journal of Electronic Materials, Microelectronics Reliability and IEEE Transactions on Advanced Packaging.