I. Lum

10 papers and 298 indexed citations i.

I. Lum has authored 10 papers that have received a total of 298 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Advanced Welding Techniques Analysis (3 papers). I. Lum is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Advanced Welding Techniques Analysis (3 papers) and collaborates with scholars based in Canada, China and Qatar. I. Lum's co-authors include Y. Zhou, M. Mayer, Chunqing Wang, C.J. Hang and Dong Du and has published in prestigious journals such as Journal of Applied Physics, Journal of Materials Processing Technology and Metallurgical and Materials Transactions A