J. K. Shang

24 papers and 418 indexed citations i.

J. K. Shang has authored 24 papers that have received a total of 418 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (5 papers). J. K. Shang is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (5 papers) and collaborates with scholars based in United States and China. J. K. Shang's co-authors include Qingsheng Zhu, Zijun Wang, Zhi‐Quan Liu, Hauyu Baobab Liu and Xueyong Pang and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Thin Solid Films