Ja‐Myeong Koo

37 papers and 511 indexed citations i.

Ja‐Myeong Koo has authored 37 papers that have received a total of 511 indexed citations. This includes 32 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Advanced Welding Techniques Analysis (15 papers). Ja‐Myeong Koo is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Advanced Welding Techniques Analysis (15 papers) and collaborates with scholars based in South Korea, Singapore and China. Ja‐Myeong Koo's co-authors include Seung‐Boo Jung, Jeong‐Won Yoon, Jong‐Woong Kim, Bo‐In Noh and Dae‐Gon Kim and has published in prestigious journals such as Advanced Materials, Materials Science and Engineering A and Journal of Materials Science