Jeff Suhling
About
Jeff Suhling has authored 27 papers that have received a total of 386 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 8 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Fatigue and fracture mechanics (6 papers). Jeff Suhling is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Fatigue and fracture mechanics (6 papers) and collaborates with scholars based in United States, South Korea and China. Jeff Suhling's co-authors include Pradeep Lall, R. E. Rowlands, David Locker, Nokibul Islam and Wayne Johnson and has published in prestigious journals such as Engineering Fracture Mechanics, Experimental Mechanics and Microelectronics Reliability
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