J.H. Huang
About
J.H. Huang has authored 24 papers that have received a total of 699 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Magnetic Properties of Alloys (8 papers) and Electrodeposition and Electroless Coatings (7 papers). J.H. Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Magnetic Properties of Alloys (8 papers) and Electrodeposition and Electroless Coatings (7 papers) and collaborates with scholars based in Taiwan, China and Germany. J.H. Huang's co-authors include P. C. Kuo, Tsao‐Cheng Huang, C. R. Kao, Chin-Li Kao and David Tarng and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of Hazardous Materials
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