J.H. Huang
About
J.H. Huang has authored 24 papers that have received a total of 699 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Magnetic Properties of Alloys (8 papers) and Electrodeposition and Electroless Coatings (7 papers). J.H. Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Magnetic Properties of Alloys (8 papers) and Electrodeposition and Electroless Coatings (7 papers) and collaborates with scholars based in Taiwan, China and Germany. J.H. Huang's co-authors include P. C. Kuo, Tsao‐Cheng Huang, C. R. Kao, Chin-Li Kao and David Tarng and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of Hazardous Materials
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Jeremy Potriquet are published in Top fields papers by Dongping Lin are about Top fields papers by Andrew W. Siu are about Top journals papers by A. B. Stephenson are published in Top countries impacted by papers by Seppo Mikkonen Top authors papers by Toru Uehara are co-authored with Top countries impacted by papers by Antonella Cerquiglini Top countries impacted by papers by Patrícia Cristine Borck