Jin Shang

60 papers and 976 indexed citations i.

Jin Shang has authored 60 papers that have received a total of 976 indexed citations. This includes 39 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 10 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (19 papers) and Intermetallics and Advanced Alloy Properties (12 papers). Jin Shang is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (19 papers) and Intermetallics and Advanced Alloy Properties (12 papers) and collaborates with scholars based in China, United States and Taiwan. Jin Shang's co-authors include Jingdong Guo, Zhi‐Quan Liu, Qingsheng Zhu, Panju Shang and Xiang Guan and has published in prestigious journals such as The Journal of Chemical Physics, Applied Physics Letters and Acta Materialia