Jin Yu

112 papers and 3.8k indexed citations i.

Jin Yu has authored 112 papers that have received a total of 3.8k indexed citations. This includes 69 papers in Electrical and Electronic Engineering, 60 papers in Mechanical Engineering and 33 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (52 papers), High Temperature Alloys and Creep (20 papers) and 3D IC and TSV technologies (18 papers). Jin Yu is often cited by papers focused on Electronic Packaging and Soldering Technologies (52 papers), High Temperature Alloys and Creep (20 papers) and 3D IC and TSV technologies (18 papers) and collaborates with scholars based in South Korea, United States and China. Jin Yu's co-authors include Jae Yong Song, Da‐Yuan Shih, Segi Byun, Sung K. Kang and Yoonchul Sohn and has published in prestigious journals such as Journal of the American Chemical Society, Nano Letters and Applied Physics Letters.