Sung K. Kang

45 papers and 1.5k indexed citations i.

Sung K. Kang has authored 45 papers that have received a total of 1.5k indexed citations. This includes 34 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 6 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (13 papers). Sung K. Kang is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (13 papers) and collaborates with scholars based in United States, South Korea and Taiwan. Sung K. Kang's co-authors include Da‐Yuan Shih, Hyuck Mo Lee, Sun-Kyoung Seo, Moon Gi Cho and Timothy Gosselin and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society