Timothy Gosselin

6 papers and 552 indexed citations i.

Timothy Gosselin has authored 6 papers that have received a total of 552 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Advanced Welding Techniques Analysis (4 papers) and 3D IC and TSV technologies (4 papers). Timothy Gosselin is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Advanced Welding Techniques Analysis (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States and South Korea. Timothy Gosselin's co-authors include Da‐Yuan Shih, Sung K. Kang, Karl J. Puttlitz, C. C. Goldsmith and Donald W. Henderson and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, JOM and MATERIALS TRANSACTIONS