Donald W. Henderson

11 papers and 1.5k indexed citations i.

Donald W. Henderson has authored 11 papers that have received a total of 1.5k indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 5 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloy Microstructure Properties (5 papers) and Advanced Welding Techniques Analysis (4 papers). Donald W. Henderson is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloy Microstructure Properties (5 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in United States, South Korea and Canada. Donald W. Henderson's co-authors include Da‐Yuan Shih, C. C. Goldsmith, Sung K. Kang, Timothy Gosselin and Karl J. Puttlitz and has published in prestigious journals such as Applied Physics Letters, American Journal of Obstetrics and Gynecology and Journal of Non-Crystalline Solids