Karl J. Puttlitz
About
Karl J. Puttlitz has authored 17 papers that have received a total of 956 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Advanced Welding Techniques Analysis (4 papers). Karl J. Puttlitz is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in United States and South Korea. Karl J. Puttlitz's co-authors include Da‐Yuan Shih, Timothy Gosselin, C. C. Goldsmith, Sung K. Kang and Paul Lauro and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, IBM Journal of Research and Development and JOM
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