C. C. Goldsmith

26 papers and 681 indexed citations i.

C. C. Goldsmith has authored 26 papers that have received a total of 681 indexed citations. This includes 19 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 11 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), Copper Interconnects and Reliability (8 papers) and Metal and Thin Film Mechanics (8 papers). C. C. Goldsmith is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), Copper Interconnects and Reliability (8 papers) and Metal and Thin Film Mechanics (8 papers) and collaborates with scholars based in United States and South Korea. C. C. Goldsmith's co-authors include Da‐Yuan Shih, Paul Lauro, I. C. Noyan, Sung K. Kang and Timothy Gosselin and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films