J.K. Kivilahti
About
J.K. Kivilahti has authored 109 papers that have received a total of 3.9k indexed citations.
This includes 65 papers in Electrical and Electronic Engineering, 48 papers in Mechanical Engineering and 25 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (52 papers), Intermetallics and Advanced Alloy Properties (30 papers) and 3D IC and TSV technologies (25 papers). J.K. Kivilahti is often cited by papers focused on Electronic Packaging and Soldering Technologies (52 papers), Intermetallics and Advanced Alloy Properties (30 papers) and 3D IC and TSV technologies (25 papers) and collaborates with scholars based in Finland, The Netherlands and United States. J.K. Kivilahti's co-authors include Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, F.J.J. van Loo and A.A. Kodentsov and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials
In The Last Decade
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