John H. Lau

240 papers and 3.3k indexed citations i.

John H. Lau has authored 240 papers that have received a total of 3.3k indexed citations. This includes 204 papers in Electrical and Electronic Engineering, 61 papers in Mechanical Engineering and 47 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (171 papers), 3D IC and TSV technologies (152 papers) and Electromagnetic Compatibility and Noise Suppression (24 papers). John H. Lau is often cited by papers focused on Electronic Packaging and Soldering Technologies (171 papers), 3D IC and TSV technologies (152 papers) and Electromagnetic Compatibility and Noise Suppression (24 papers) and collaborates with scholars based in United States, Taiwan and Singapore. John H. Lau's co-authors include S. W. Ricky Lee, Xiaowu Zhang, Walter Dauksher, V. Kripesh and Ming‐Jer Kao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Bone and Joint Surgery