K.-F. Becker

12 papers and 49 indexed citations i.

K.-F. Becker has authored 12 papers that have received a total of 49 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 6 papers in Automotive Engineering and 3 papers in Mechanical Engineering. The topics of these papers are Additive Manufacturing and 3D Printing Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). K.-F. Becker is often cited by papers focused on Additive Manufacturing and 3D Printing Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Germany. K.-F. Becker's co-authors include R. Aschenbrenner, Tanja Braun, V. Bader, Martin Schneider‐Ramelow and H. Reichl and has published in prestigious journals such as Macromolecular Symposia, Journal of Electronic Packaging and IEEE Transactions on Advanced Packaging