L.P. Lehman
About
L.P. Lehman has authored 16 papers that have received a total of 855 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 7 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), Aluminum Alloy Microstructure Properties (7 papers) and Advanced Welding Techniques Analysis (6 papers). L.P. Lehman is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Aluminum Alloy Microstructure Properties (7 papers) and Advanced Welding Techniques Analysis (6 papers) and collaborates with scholars based in United States. L.P. Lehman's co-authors include E. J. Cotts, Thomas R. Bieler, Seungbae Park, Yan Xing and Donald W. Henderson and has published in prestigious journals such as Acta Materialia, Surface and Coatings Technology and Journal of materials research/Pratt's guide to venture capital sources
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