Luke Wentlent

12 papers and 160 indexed citations i.

Luke Wentlent has authored 12 papers that have received a total of 160 indexed citations. This includes 12 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (5 papers) and Metallurgy and Material Forming (3 papers). Luke Wentlent is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (5 papers) and Metallurgy and Material Forming (3 papers) and collaborates with scholars based in United States, Canada and Jordan. Luke Wentlent's co-authors include Peter Børgesen, Sa’d Hamasha, Liang Yin, Christopher Greene and James B. Wilcox and has published in prestigious journals such as Journal of Electronic Materials, Microelectronics Reliability and Journal of Electronic Packaging