Min‐Su Kim
About
Min‐Su Kim has authored 59 papers that have received a total of 569 indexed citations.
This includes 29 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 17 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (9 papers) and Advanced Power Amplifier Design (5 papers). Min‐Su Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (9 papers) and Advanced Power Amplifier Design (5 papers) and collaborates with scholars based in South Korea, Japan and United States. Min‐Su Kim's co-authors include Hiroshi Nishikawa, Sung‐Chan Jung, Yong-Ho Ko, Junghwan Bang and Yang‐Kook Sun and has published in prestigious journals such as Angewandte Chemie International Edition, Journal of Applied Physics and Advanced Energy Materials
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