Ning-Cheng Lee
About
Ning-Cheng Lee has authored 22 papers that have received a total of 238 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloys Composites Properties (6 papers). Ning-Cheng Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloys Composites Properties (6 papers) and collaborates with scholars based in Taiwan, China and United Kingdom. Ning-Cheng Lee's co-authors include Weiping Liu, Jenn‐Ming Song, Kun Ma, Zhiwen Chen and Sihai Chen and has published in prestigious journals such as Review of Scientific Instruments, JOM and Journal of Electronic Materials
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