Nitesh Kumbhat
About
Nitesh Kumbhat has authored 7 papers that have received a total of 72 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 1 paper in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Radio Frequency Integrated Circuit Design (2 papers). Nitesh Kumbhat is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Radio Frequency Integrated Circuit Design (2 papers) and collaborates with scholars based in United States, Sweden and Germany. Nitesh Kumbhat's co-authors include Rao Tummala, Venky Sundaram, P. Markondeya Raj, S.K. Sitaraman and Nathaniel E. Brese and has published in prestigious journals such as steel research international and IEEE Transactions on Components Packaging and Manufacturing Technology
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