Paul T. Vianco

97 papers and 1.9k indexed citations i.

About

Paul T. Vianco has authored 97 papers that have received a total of 1.9k indexed citations. This includes 81 papers in Electrical and Electronic Engineering, 63 papers in Mechanical Engineering and 25 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloy Microstructure Properties (23 papers). Paul T. Vianco is often cited by papers focused on Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloy Microstructure Properties (23 papers) and collaborates with scholars based in United States, Hong Kong and United Kingdom. Paul T. Vianco's co-authors include Jerome A. Rejent, Jing Cheng, Paul F. Hlava, Alice C. Kilgo and I. Artaki and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Fields of papers published by Paul T. Vianco

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Paul T. Vianco

Since Specialization
Citations
Rankless by CCL
2025