Po-Jen Cheng
About
Po-Jen Cheng has authored 15 papers that have received a total of 324 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Epidemiology and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Fluid Dynamics and Thin Films (2 papers). Po-Jen Cheng is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Fluid Dynamics and Thin Films (2 papers) and collaborates with scholars based in Taiwan, United States and Sweden. Po-Jen Cheng's co-authors include Chien-Lung Liang, Kwang‐Lung Lin, Hsin‐Yi Lai, Steven W. Shaw and Chi Wang and has published in prestigious journals such as The Journal of Infectious Diseases, Journal of Materials Science and Journal of Physics D Applied Physics
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