Pradeep Lall
About
Pradeep Lall has authored 101 papers that have received a total of 821 indexed citations.
This includes 91 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (65 papers), Integrated Circuits and Semiconductor Failure Analysis (27 papers) and 3D IC and TSV technologies (25 papers). Pradeep Lall is often cited by papers focused on Electronic Packaging and Soldering Technologies (65 papers), Integrated Circuits and Semiconductor Failure Analysis (27 papers) and 3D IC and TSV technologies (25 papers) and collaborates with scholars based in United States, Israel and Germany. Pradeep Lall's co-authors include Jeff Suhling, Dhananjay Panchagade, Jeffrey C. Suhling, Kai Goebel and Junchao Wei and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Access and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
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