R. Dudek

37 papers and 213 indexed citations i.

R. Dudek has authored 37 papers that have received a total of 213 indexed citations. This includes 32 papers in Electrical and Electronic Engineering, 17 papers in Mechanics of Materials and 6 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (13 papers) and Material Properties and Processing (6 papers). R. Dudek is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (13 papers) and Material Properties and Processing (6 papers) and collaborates with scholars based in Germany, Poland and France. R. Dudek's co-authors include B. Michel, Sven Rzepka, Bernd Michel, Andreas Schubert and R. Tilgner and has published in prestigious journals such as Microelectronics Reliability, Microsystem Technologies and Materials Today Proceedings