R. Taïbi

7 papers and 129 indexed citations i.

R. Taïbi has authored 7 papers that have received a total of 129 indexed citations. This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Plant Science. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (3 papers). R. Taïbi is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (3 papers) and collaborates with scholars based in France, Switzerland and Algeria. R. Taïbi's co-authors include L. Di Cioccio, F. Rieutord, Pierric Gueguen, F. de Crécy and Didier Landru and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Microelectronics Reliability