R.N. Master

11 papers and 113 indexed citations i.

R.N. Master has authored 11 papers that have received a total of 113 indexed citations. This includes 11 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). R.N. Master is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers) and collaborates with scholars based in United States and Canada. R.N. Master's co-authors include Madhavan Swaminathan, C.P. Wong, Rao Tummala, Myung Jin Yim and Sang-Il Lee and has published in prestigious journals such as IBM Journal of Research and Development, IEEE Transactions on Electromagnetic Compatibility and IEEE Transactions on Device and Materials Reliability