Seung Wook Yoon

38 papers and 587 indexed citations i.

Seung Wook Yoon has authored 38 papers that have received a total of 587 indexed citations. This includes 35 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (27 papers) and Copper Interconnects and Reliability (7 papers). Seung Wook Yoon is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (27 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in Singapore, South Korea and United States. Seung Wook Yoon's co-authors include V. Kripesh, Hyuck Mo Lee, John H. Lau, A.A.O. Tay and Tai Chong Chai and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Scripta Materialia.