S.K. Sitaraman
About
S.K. Sitaraman has authored 16 papers that have received a total of 203 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). S.K. Sitaraman is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers) and collaborates with scholars based in United States and South Korea. S.K. Sitaraman's co-authors include Rao Tummala, Venky Sundaram, P. Markondeya Raj, Joungho Kim and Youngwoo Kim and has published in prestigious journals such as Proceedings of the IEEE, IEEE Transactions on Electromagnetic Compatibility and IEEE Transactions on Components and Packaging Technologies
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