T. Marieb

41 papers and 484 indexed citations i.

T. Marieb has authored 41 papers that have received a total of 484 indexed citations. This includes 32 papers in Electronic, Optical and Magnetic Materials, 26 papers in Electrical and Electronic Engineering and 12 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (32 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (15 papers). T. Marieb is often cited by papers focused on Copper Interconnects and Reliability (32 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (15 papers) and collaborates with scholars based in United States, France and Germany. T. Marieb's co-authors include J. C. Bravman, P. A. Flinn, Michael C. Madden, Paul A. Flinn and Richard Celestre and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics