T. Nogami

35 papers and 474 indexed citations i.

T. Nogami has authored 35 papers that have received a total of 474 indexed citations. This includes 23 papers in Electrical and Electronic Engineering, 23 papers in Electronic, Optical and Magnetic Materials and 5 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (13 papers) and Electronic Packaging and Soldering Technologies (11 papers). T. Nogami is often cited by papers focused on Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (13 papers) and Electronic Packaging and Soldering Technologies (11 papers) and collaborates with scholars based in United States, Japan and Germany. T. Nogami's co-authors include D. Edelstein, Chunhua Hu, H. Shobha, O. van der Straten and James J. Kelly and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices