Tae‐Ik Lee

33 papers and 1.1k indexed citations i.

Tae‐Ik Lee has authored 33 papers that have received a total of 1.1k indexed citations. This includes 22 papers in Biomedical Engineering, 19 papers in Electrical and Electronic Engineering and 7 papers in Mechanical Engineering. The topics of these papers are Advanced Sensor and Energy Harvesting Materials (16 papers), Electronic Packaging and Soldering Technologies (12 papers) and 3D IC and TSV technologies (6 papers). Tae‐Ik Lee is often cited by papers focused on Advanced Sensor and Energy Harvesting Materials (16 papers), Electronic Packaging and Soldering Technologies (12 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in South Korea, United States and Germany. Tae‐Ik Lee's co-authors include Taek‐Soo Kim, Cheolgyu Kim, Min Sung Kim, Kyung‐Wook Paik and Jihye Kim and has published in prestigious journals such as ACS Nano, Advanced Functional Materials and Scientific Reports