Tz-Cheng Chiu
About
Tz-Cheng Chiu has authored 33 papers that have received a total of 596 indexed citations.
This includes 18 papers in Mechanics of Materials, 17 papers in Electrical and Electronic Engineering and 13 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), Mechanical Behavior of Composites (10 papers) and Numerical methods in engineering (8 papers). Tz-Cheng Chiu is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), Mechanical Behavior of Composites (10 papers) and Numerical methods in engineering (8 papers) and collaborates with scholars based in Taiwan and United States. Tz-Cheng Chiu's co-authors include Kuo‐Shen Chen, Fazil Erdögan, Tian-Shiang Yang, Darvin Edwards and Yi-Shao Lai and has published in prestigious journals such as Journal of Applied Physics, International Journal of Heat and Mass Transfer and Journal of Sound and Vibration
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