W. Engelmaier
About
W. Engelmaier has authored 16 papers that have received a total of 414 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (6 papers) and Engineering and Materials Science Studies (3 papers). W. Engelmaier is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (6 papers) and Engineering and Materials Science Studies (3 papers) and collaborates with scholars based in United States and Belgium. W. Engelmaier's co-authors include Abhijit Dasgupta, Konstantina Lambrinou, D. B. Barker, Michael Pecht and J. A. Augis and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Electronic Packaging and Journal of ASTM International.
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