W.C. Chiou
About
W.C. Chiou has authored 7 papers that have received a total of 132 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 1 paper in Artificial Intelligence and 1 paper in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (2 papers) and Semiconductor materials and devices (2 papers). W.C. Chiou is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (2 papers) and Semiconductor materials and devices (2 papers) and collaborates with scholars based in Taiwan, United States and China. W.C. Chiou's co-authors include Douglas Yu, S. Y. Hou, K. C. Ting, Cheng‐Hsien Wu and Chih-Chieh Hsu and has published in prestigious journals such as IEEE Transactions on Electron Devices and Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms.
In The Last Decade
side by side view
Countries citing papers authored by W.C. Chiou
Since SpecializationCitations
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Jennifer Chiang Breakdown of academic impact, for papers by Joseph L. Camp Breakdown of academic impact, for papers by Daniel Gluckstein Breakdown of academic impact, for papers by Simona Boboila Breakdown of academic impact, for papers by C. Langford Breakdown of academic impact, for papers by R. Taïbi Breakdown of academic impact, for papers by David P. Noren Breakdown of academic impact, for papers by Zoran Gajic