W.C. Chiou

7 papers and 131 indexed citations i.

W.C. Chiou has authored 7 papers that have received a total of 131 indexed citations. This includes 5 papers in Electrical and Electronic Engineering, 1 paper in Artificial Intelligence and 1 paper in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (2 papers) and Semiconductor materials and devices (2 papers). W.C. Chiou is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (2 papers) and Semiconductor materials and devices (2 papers) and collaborates with scholars based in Taiwan, United States and China. W.C. Chiou's co-authors include Douglas Yu, S. Y. Hou, K. C. Ting, Cheng‐Hsien Wu and Chih-Chieh Hsu and has published in prestigious journals such as IEEE Transactions on Electron Devices and Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms