Yishu Wang

68 papers and 430 indexed citations i.

Yishu Wang has authored 68 papers that have received a total of 430 indexed citations. This includes 42 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (22 papers) and Aluminum Alloys Composites Properties (13 papers). Yishu Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (22 papers) and Aluminum Alloys Composites Properties (13 papers) and collaborates with scholars based in China, United States and Japan. Yishu Wang's co-authors include Fu Guo, Fu Guo, Sihong Liu, Jing Han and Yufeng Wu and has published in prestigious journals such as Applied Physics Letters, Journal of Cleaner Production and Chemical Engineering Journal