Young-Eui Shin
About
Young-Eui Shin has authored 46 papers that have received a total of 308 indexed citations.
This includes 42 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (11 papers). Young-Eui Shin is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (11 papers) and collaborates with scholars based in South Korea, Japan and United States. Young-Eui Shin's co-authors include Seung‐Boo Jung, Min-Soo Kang, Jong‐Min Kim, Sung Hyun Kim and Seong Hyuk Lee and has published in prestigious journals such as Japanese Journal of Applied Physics, Materials and Sensors and Actuators A Physical.
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by S.S. Lukashov are co-authored with Top fields papers by C. Rönnbäck are about Top journals papers by О. В. Игнатов are published in Top fields papers by David Warriner are about Top countries impacted by papers by Lauri Viitasaari Top journals papers by Zahra Bahrololoomi are published in Top countries impacted by papers by Antonio Mihi‐Ramírez Top journals papers by Nick Robinson are published in